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Production capability

 

       
Half hole
 
BGA
Gold finger
         
impedance control

 4 oz copper thick 

In the groove
           
Headset board
Carbon oil 
Nature white solder mask
           
 
 
Micro chip
   

 

 Layer Count

 

1----16

 

2

The max working size

449*559、18“ * 24”

3

The minimum thickness

4: 0.40mm / 16mil

 

 

6: 0.80mm / 32mil

 

 

8: 1.00mm / 40mil

 

 

10: 1.60mm / 60mil

4

The minimum thickness

0.20mm / 8mil

5

Minimum line spacing

0.10mm / 4mil

6

Minimum line width

0.10mm / 4mil

7

The smallest through hole

0.20mm / 10mil

8

The minimum welding plate

0.40mm / 18mil

9

The hole wall copper thickness

0.025mm / 1mil

10

Metallized hole size tolerance

±0.075mm / 3mil

11

Non-metallic hole size tolerance

±0.05mm / 2mil

12

The dimension tolerance

±0.10mm / 4mil

13

Distortion and bend

≤ 1.5%

14

Pore size tolerance

±0.05mm / 2mil

15

The minimum resistance welding bridge

0.10mm / 4mil

16

Insulation resistance

Ohm the norm

17

Hole resistance

<300normal

18

delectric strength

>1.3kv / mm

19

Resistance to current

10A

20

Peel strength

1.5N / mm

21

Solder Mask Abrasion

>6H

22

Thermal shock

288 ℃、10 seconds, three times

23

Flammability rate

94V-0

24

On-off test voltage

50-300V

25

The product type

Double side, multi-layer, blind hole, hole

error

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